The Process Engineering Director is responsible for leading the overall performance, strategic planning and budget for all fab process areas. Additional responsibilities include, but are not limited to:
Completing all required safety training and ensuring all work is conducted in accordance with Intel safety policies
Establishing clear goals and challenging timelines for all area yield, process, equipment, and integration concerns
Managing all staffing, training, technical mentorship, and personnel development for area team members
Developing a strong business relationship with all area vendors
Balancing cost, quality, and output with area equipment levels to meet capacity demands
Collaborating with production and planning to continually improve area efficiency and increase output
Partnering with area managers and other section managers to meet the needs of the fab and build strong peer relationships
Ensuring the measurement and reduction of all process and equipment variation in the area
Coordinating with central team, purchasing, process integration, planning, and production on new tool purchases
Partnering with production to continually improve area efficiency, shift communication, and wafer output
Partnering with PIE and QE teams to meet the needs of all new parts, equipment, and process changes
Optimizing area performance to align with the business plan, strategies and goals
Coordinating Capital Asset Utilization and TPM activities
Partnering with other 300 mm counterparts to identify and leverage global best-known methods
Managing the performance and professional development of direct reports
Facilitating the technical and career development of all area personnel
Encouraging team member engagement by setting challenging goals
Managing projects to ensure deliverables are completed within the required timeframe
Knowing policies and partnering closely with HR
Ensuring area has succession plans for all key positions
Ensuring that area scrap and excursion reduction plans are created and carried out
Qualifications
Proven track record for technical leadership in advanced Memory process technologies
Proven ability to drive multiple complex projects to completion at the same time
Proven ability to communicate and present technical information effectively
Proven ability to make sound, data-driven decisions
Proven ability to accurately analyze and interpret data
Strong conflict management and negotiation skills
Strong organizational and prioritization skills
Proven ability to develop and coach team members
Proven ability to mentor and successfully manage the performance of direct and eventual reports
Demonstrated ability to partner successfully with other groups and build strong peer relationships
Proven ability to solicit feedback, accepts input, and analyzes success/failure
Proven ability to identify, understand, and mitigate risk before making critical decisions
Advanced understanding of semiconductor manufacturing
Position requires an assignment in the Intel Dalian (Fab68) for approximately a 2-3 years commitment. Standard Intel Expat package applies.
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