We are seeking a Principal optical component packaging Engineer to be an important team member in the research, design and development for optical communications.
In parallel to interact with global optical chip development teams for chip technology planning and development so as to keep overall competitive of optical component products.
Support to improve design/engineering capability of current package team, support key package technology breakthrough in current product for project delivery.
Qualifications:
PhD in Applied Physics, EE, or Material Science preferred.
More than 10 years of related experience: Background on materials, RF or optoelectronics,knowledge and engineering experience in multi field of optical, mechanical, RF, thermal and materials etc, well-known industry expert in at least one of above fields.
Rich experience in optical package integration and technology management.
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